Computer on Modules(COMs) - Future Systems

Products

Home » Hardware » Single Board Computers » Computer on Modules(COMs)

Computer on Modules(COMs)

Ultra-Rugged COM Express® Basic Type 6
AMD V1807B, 3.35 GHz
32GB DDR4 (ECC)
32 GB eMMC
3x USB 3.2 Gen 1x1, 3x USB 2.0, 1x PCIe x4, 6x PCIe x1, conduction cooling frame

COM Express Mini Type 10
Intel Atom Processor x7000RE series (Amston Lake)
4GB ~ 16GB LPDDR5 (ECC) soldered
64GB eMMC soldered
2x SATA 3.2, 1 x DP1.4a, 1x HD Audio, 2x USB3.2, 6x USB2.0, 1x USB Type C, 1x 2.5GbE, 4, PCI3.0 x1, 2x UART, 1x I2C, 1x SMB
Heat spreader (optional), Linux

COM Express Rel. 3.1 Type 6
Intel® Core™ Ultra Series 3 processors with embedded 50TOPS Intel NPU5
2x DDR5-5600 SO-DIMM slots, up to 96GB
Up to 1 TByte NVMe SSD, 2x SATA
1x PCIe Gen5 x8, 2x USB4.0(40Gbps), 4x USB3.2(10Gbps), 8x USB2.0, 2x USB Type-C (DP Alt Mode, HDMI, DP) 1x eDP1.5, 1x 2.5GbE, HD Audio, 2x 2-wires UARTs, 4x GPI, 4x GPO
Heat spreader (optional), Microsoft® Windows 11 IoT Enterprise, Yocto Linux

COM Express Rel. 3.1 Type 6
Qualcomm® Dragonwing IQ-X Series with Hexagon NPU, up to 45 TOPS
Up to 64GB LPDDR5
UFS 4.0 module on-board, microSD card slot, I2C EEPROM
2x DP(USB Type-C DP Alt Mode), 1x DDI, 1x eDP(or 1x LVDS)., 2x PCIe x2 Gen4 or 1x PCIe x4 Gen4, 1x PCIe x2 Gen3, 2x USB4, 2x USB 10Gbps, 8x USB2.0, 1x 2.5GbE, 2x 2-wires UARTs, 4x GPI, 4x GPO
Heat spreader (optional), Microsoft® Windows 11 IoT Enterprise, Yocto Linux

COM Express Type 6
AMD Ryzen™ AI Embedded P100 Series Processor, AMD XDNA™ 2 NPU, AMD Radeon™ RDNA™ 3.5 GPU
2x DDR5-5600 SO-DIMM slots, up to 96GB
2x SATA Gen3
2x DP(USB Type-C DP Alt Mode), 1x DDI, 1x eDP(or 1x LVDS)., 7x PCIe x1 Gen4, 2x USB4, 8x USB2.0, 1x 2.5GbE, 2x 2-wires UARTs, SPI, I2C, SMB bus
Heat spreader (optional), Windows 11 LTSC, Yocto Linux

COM Express Type 6
Qualcomm Dragonwing™ IQ-9075 (QCS 9075-0-AC) NPU @50TOPS, Qualcomm Dragonwing™ IQ-9075 (QCS 9075-0-AA) NPU @100TOPS
Up to 36GB LPDDR5-3200 soldered (ECC)
UFS 3.1 Gear 4, 2-lane drive soldered on-board, up to 256GB
3x DP1.4, 1x PCIe Gen 4 x4, 1x PCIe Gen4 x2, 4x USB3.0, 8, USB 2.0
Heat spreader (optional), Clea OS, Yocto Linux

COM Express Type 6
APU AMD Ryzen™ 7 Pro and 5 Pro 8000 U and HS Series Integrated AMD RDNA 3 graphics with up to 6 WGPs
2x DDR5-5600 SODIMM Slots
2x SATA Gen3, eMMC 5.1 drive soldered on-board(Optiona)
2x DDI(DP2.0, HDMI2.1, Type-C DP Alt Mode), 1x DDI, eDP1.5, 8x PCIe Gen 4 lanes, 1x 8 or 2x4 PCIe Gen4, 2x USB4.0, 2x USB3.2(10Gbps), 8x USB2.0, 2x 2-wires UARTs, LPC Bus, SPI, I2C, 4x GPI, 4x GPO
Heat spreader (optional), Clea OS (Yocto Linux), Microsoft® Windows 11 IoT Enterprise

COM Express Type 6
Intel Atom® Processors x7000RE (Amston Lake)
1x DDR5-5600 SODIMM Slots
2x SATA Gen3, eMMC 5.1 drive soldered on-board(Optiona)
2x DDI(DP2.0, HDMI2.1, Type-C DP Alt Mode), 1x DDI, eDP1.5, 6x PCIe Gen 3 lanes, 2x USB3.2 (10Gbps), 8x USB2.0, 2x 2-wires UARTs, LPC Bus, SPI, 2x I2C, 4x GPI, 4x GPO
Heat spreader (optional), Windows 10 IoT Enterprise (2019/2021 LTSC), Clea OS (Yocto Linux)

COM-HPC® Size A Client Module
Intel® Core™ Ultra Processors Family
2x DDR5-5200 SO-DIMM Slots
2 x SATAGen3, M.2 NVMe SSD(PCIe x4)
3x DDP, 1x eDP1.4b, 1x PCIe x8 Gen5, 2x PCIe x 4 Gen4, 4x USB 4.0, 2x 2.5GbE, Wi-Fi 6E, 2x 4-lane CSI-2 interfaces, SPI, SM Bus, 2x I2C
Heat spreader (optional), Windows 10 IoT Enterprise LTSC, Linux Kernel LTS, Clea OS (Yocto Linux)

COM-HPC® Size A Client Module
Intel® 11th Gen Xeon®, Core™ and Celeron® processors
2x DDR4-3200 SO-DIMM Slots
2 x SATAGen3, M.2 NVMe SSD(PCIe x4)
3x DP++, 1x eDP1.4b, 16x PCIe Gen4 lanes, 1x PCIe Gen4 x4, 2x USB4, 2x USB 3.2 Gen 2x2, 2x 2.5GbE, 2x UART, 2x 4-lane CSI-2 interfaces, SPI, eSPI, SMBus, 2x I2C, 12x GPIO
Heat spreader (optional), Windows 10 IoT Enterprise LTSC, Linux Kernel LTS, Yocto Project 3.0, WindRiver VxWorks 7.0, Android

Qseven® Module
Intel® Atom® x6000E Series / Intel® Pentium® and Celeron® N and J Series processors
Up to 16GB Quad-Channel LPDDR4 Soldered (IBECC)
2x SATA Gen3, eMMC 5.1 drive soldered on-board(Optiona)
1x eDP1.3, 1x DP++1.4 or HDMI1.4, 4x PCIe Gen3 x1, 2x USB3.2, 6xUSB2.0, 1x 1GbE, 2x UART, SPI, I2C, I2S, CAN, SM Bus, Watchdog
Microsoft® Windows 10 IoT Enterprise, Yocto Linux

μQseven® Module
NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
4GB DDR4 (I,MX 8M Mini) / 2GB DDR4 (I,MX 8M Nanoi)
eMMC 5.1 drive on-board, up to 64 GB SD / MMC / SDIO interface
1x LDVS or eDP interface, 1x 1GbE, Optional Wi-Fi 802.11 a/b/g/n/ac + BT 5.0 NGFF module soldered on-board, 5x USB2.0, 1x PCIe x1, 1x 4-wire UART, 1x Debug UART, SPI, 8x GPIO
Linux (Yocto)

SMARC® Module
NXP i.MX 95: 6x Cortex-A55 @2GHz ,1x M33 core @333MHz, 1x M7 core @800MHz
Up to 16 GB LPDDR5 6.4 GT/s (32-bit)
Up to 128 GB eMMC 5.1 drive soldered on-board (boot device)
2x LVDS single-channel / 1x LVDS dual-channel, 1x 4-lanes CSI camera interface, Up to 2x 1GbE, Wi-Fi + BT/BLE 5.3 module soldered on-board(Optional), Up to 2x PCIe Gen 3 x1, 1x I2S , 2x 4-wire UART, 2x 2-wire UART, 1x I2C, 1x SPI, 2x PWM, 12x GPIO
Linux (Yocto)

SMARC® Module
Intel Atom® processors x7000E Series (Codename: Alder Lake) / Intel® Core™ i3 processor, Intel® Processors N Series
Up to 16GB Quad-Channel LPDDR5 Soldered (IBECC)
1 x SATAGen3, eMMC 5.1 (Optional)
1x eDP, 1x DP++, 1x dual-channel, LVDS, 2x 2.5GbE, 4x PCIe Gen 3 lanes, 2x USB 3.2, 6x USB 2.0, 2x UART, 2x UART(HS-UART), 14x GPIO, SMBus, I2C, SPI or eSPI
Microsoft® Windows 10, Linux Kernel LTS

SMARC® Module
Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake)
Up to 32GB Quad-Channel LPDDR5 Soldered (IBECC)
1 x SATAGen3, eMMC 5.1 (Optional)
1x eDP1.3 or dual LVDSD, 2x DP++, 2x MIPI CSI-2 inputs, 2x 2.5GbE, 2x USB3.2(10Gbps), 6x USB2.0, 2x UARTs 2x HS-UARTs, 14x GPIO, SMBus, I2C, SPI
Microsoft® Windows 10 LTSC, Windows 11 LTSC Linux Kernel LTS